Showing results: 31 - 35 of 35 items found.
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EverythingPCB
ATE, ICT, semiautomatic & manual electronic test fixtures, PCB test fixtures, cable test fixture, wiring harness test fixtures, dedicated test fixtures, functional test fixtures, electronic test fixture programming. PADS Schematic capture, circuit board layout, PCB design prototype, solder paste stencils, X-Y coordinate data, B.O.M. maintenance, and manufacturing documentation, Gerber data.
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MV-3L -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-BEAM® Laser Inspection System- 3D Co-Planarity Inspection of BGA and CSP Devices- Enhanced 3D Solder Paste Height Measurement Capability - INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Teledyne Defense Electronics
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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MV-6e -
MIRTEC Co., Ltd.
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Zero-Ion G3 -
Manncorp
For two decades, thousands of electronics assemblers have relied on the Zero-Ion cleanliness testing to verify the cleanliness of post-reflow printed circuit assemblies and bare boards. Over time, as PCB assemblies have become more complex and more densely populated with surface mount components, and as vigorous quality standards such as ISO, TQM and Six Sigma have become commonplace, the ability to meet—and confirm—cleanliness levels has grown in importance. The Zero-Ion ROSE tester has kept pace with customer requirements, and the Zero-Ion G3 is the most advanced Zero-Ion ever designed, capable of testing assemblies reflowed with any solder paste, including no clean—yet its also one of the most affordable cleanliness testers on the market as well, with performance and ease of use second to none.
